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A 12-inch wafer - dedicated integrated coating and developing equipment. It enables uniform photoresist coating and precise developing. By optimizing parameters like coating rotation speed and developing time, it ensures
A single - wafer chemical cleaning equipment. It uses customized chemical reagents and cleaning processes to target and remove contaminants (such as particles and organic residues) on the wafer surface. It avoids cross -
A single - wafer wet etching equipment based on wet process. By precisely controlling the concentration, temperature and contact time of the etchant, it achieves selective etching of wafer materials (such as silicon and
The Gluing Machine ASP Series (SPRAY COATER) is a high-performance gluing equipment leveraging advanced spray coating technology. It uniformly applies photoresist across wafer surfaces via high-pressure spraying, outperf
The Adhesive Removal and Peeling Machine AST Series (PR STRIPPER/METAL LIFT - OFF) is an Advanced Process Equipment integrating photoresist stripping and metal lift-off functions. It efficiently removes photoresist and e
The ACL series physical cleaning machine (SCRUBBER) is an Advanced Process Equipment utilizing physical friction (e.g., brush scrubbing) for semiconductor substrate cleaning. Equipped with ultrapure water or inert gas, i
