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Gluing Machine ASP Series
The Gluing Machine ASP Series (SPRAY COATER) is a high-performance gluing equipment leveraging advanced spray coating technology. It uniformly applies photoresist across wafer surfaces via high-pressure spraying, outperforming traditional spin coating—especially for substrates with special morphologies. This system enables flexible adjustment of coating thickness while ensuring exceptional uniformity, making it highly adaptable to diverse semiconductor gluing processes and precision manufacturing requirements.
Equipment Configuration
2-4 chambers (options: COT, DEV)
Substrate Materials
Si, Glass, etc.
Applicable Processes
Deep-hole spray bonding TSV, High aspect ratio step spray bonding
Process Specifications
Planar uniformity ≤ 5% @ 5-10 µm, Step coverage ≥ 30%
Application Fields
Advanced packaging, MEMS, research, etc.
Equipment Dimensions
2665*2825*2550mm (W*D*H)
Technical Features
Suitable for spraying processes on circular or square substrates with deep holes engraved on the surface, requiring ultrasonic atomization of the photoresist particles.
Can uniformly cover the step surface, edges, side walls, and bottom;
The equipment can be configured with a dispensing chamber and a developing chamber.
2-4 chambers (options: COT, DEV)
Substrate Materials
Si, Glass, etc.
Applicable Processes
Deep-hole spray bonding TSV, High aspect ratio step spray bonding
Process Specifications
Planar uniformity ≤ 5% @ 5-10 µm, Step coverage ≥ 30%
Application Fields
Advanced packaging, MEMS, research, etc.
Equipment Dimensions
2665*2825*2550mm (W*D*H)
Technical Features
Suitable for spraying processes on circular or square substrates with deep holes engraved on the surface, requiring ultrasonic atomization of the photoresist particles.
Can uniformly cover the step surface, edges, side walls, and bottom;
The equipment can be configured with a dispensing chamber and a developing chamber.
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