Desktop semi-automatic wafer tape mounting equipment
Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process. • Corresponding processing of 4"~8"/8"~"12" wafer products • Wa
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Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process. • Corresponding processing of 4"~8"/8"~"12" wafer products • Wa
ATW5000 series tape mounting machine is applicable to the tape mounting process before wafer thinning. Advanced roller tape mounting technology is applied to the equipment. which can complete the contact tape
Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process. • Corresponding processing of 4"~8"/8"~"12" wafer products • Wa
Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process. • Corresponding processing of 4"~8"/8"~"12" wafer products • Wa
ATW5000 series tape mounting machine is applicable to the tape mounting process before wafer thinning. Advanced roller tape mounting technology is applied to the equipment. which can complete the contact tape
ATW8000 series tape mounting machine is applicable to the tape mounting process before wafer dicing. Advanced vacuum tape mounting technology is applied to the equipment, which can complete the contact and non-
• GDR350 series is applicable to the tape peeling process after wafer thinning. Advanced tape peeling technology is applied, which can be compatible with adhesive tape and hot melt tape. 4 "-12" wa
• ADW3300 series de-taping machine is applicable to the de-taping process after wafer thinning. Advanced de-taping technology isapplied, which can be compatible with adhesive tape and hot melt tape. 8/12
Semiconductor post-process, the wafer non-contact splitting process equipment after wafer laser stealth dicing process. • Corresponding processing of 4"~12" wafer product • Correspon
