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Physical Cleaning Machine ACL Series
The ACL series physical cleaning machine (SCRUBBER) is an Advanced Process Equipment utilizing physical friction (e.g., brush scrubbing) for semiconductor substrate cleaning. Equipped with ultrapure water or inert gas, it physically removes stubborn particles and light contaminants from wafer surfaces without chemical reagents, eliminating residue risks. This advanced system is ideal for cleaning substrates sensitive to chemical treatments, ensuring surface purity critical for high-precision semiconductor manufacturing processes.
Equipment Configuration
2-8 chambers (optional)
Substrate Materials
Si, SiC, Glass, GaAs, InP, Sapphire, LN, LT
Applicable Processes
Incoming material cleaning, CMP post-cleaning, marking post-cleaning, backside cleaning, photoresist residue cleaning
Process Indicators
Particle control (≤ 10 per 0.1 µm), Metal ion control (5E9 atms/cm2)
Application Fields
IC, power devices, RF integration, semiconductor optics, optical communications, research, reticle, etc.
Equipment Dimensions
2-4 chambers 2139*1986*2519 (W*D*H), 8 chambers 2400*3704*2950 (W*D*H)
Technical Features
· The machine can achieve multi-size compatibility;
· The wafer surface has stable downflow, effectively controlling the static and dynamic environments within the chambers;
· Up to three liquid spraying arms and one fixed nozzle enable the mixed use of various spraying methods;
· Gas-liquid separation mechanism, separate disposal of organic and DIW.
2-8 chambers (optional)
Substrate Materials
Si, SiC, Glass, GaAs, InP, Sapphire, LN, LT
Applicable Processes
Incoming material cleaning, CMP post-cleaning, marking post-cleaning, backside cleaning, photoresist residue cleaning
Process Indicators
Particle control (≤ 10 per 0.1 µm), Metal ion control (5E9 atms/cm2)
Application Fields
IC, power devices, RF integration, semiconductor optics, optical communications, research, reticle, etc.
Equipment Dimensions
2-4 chambers 2139*1986*2519 (W*D*H), 8 chambers 2400*3704*2950 (W*D*H)
Technical Features
· The machine can achieve multi-size compatibility;
· The wafer surface has stable downflow, effectively controlling the static and dynamic environments within the chambers;
· Up to three liquid spraying arms and one fixed nozzle enable the mixed use of various spraying methods;
· Gas-liquid separation mechanism, separate disposal of organic and DIW.
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