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Single-Chip Wet Etching Machine AEH Series
A single - wafer wet etching equipment based on wet process. By precisely controlling the concentration, temperature and contact time of the etchant, it achieves selective etching of wafer materials (such as silicon and metal layers). It has high etching precision and clear edge contours, meeting the processing needs of fine structures of semiconductor devices.
Equipment Configuration
2-8 chambers (optional)
Substrate Materials
Si, SiC, GaAs, InP
Applicable Processes
Silica/Silicon Nitride Etching (SiOx/SiNx etch), Metal Etching/Metal etch (Cu, Ti, Au, Cr, Ni, etc.), Tin Oxide/Zinc Oxide (TO/GZO) etc.
Process Specifications
Dielectric Etching Uniformity < 5%, Metal Etching Uniformity < 5%, Particle Control (≤ 10 ea @ 0.2 µm)
Application Fields
IC, Power Devices, RF Integration, Semiconductor Optics, Optical Communications, Research, etc.
Equipment Dimensions
2-4 chambers 2560*2426*2863 (W*D*H), 8 chambers 5252*2412*2959(W*D*H)
Technical Features
· The machine can achieve multi-size compatibility;
· The process chambers have been optimized for design, providing excellent cleanliness control;
· Compatible with copper/bowl etching solutions in the same chamber and can achieve independent recycling and reuse, up to 4 types of solutions in the same chamber;
· Can be used in conjunction with Nano spray process and IPA N2 dry drying processes;
2-8 chambers (optional)
Substrate Materials
Si, SiC, GaAs, InP
Applicable Processes
Silica/Silicon Nitride Etching (SiOx/SiNx etch), Metal Etching/Metal etch (Cu, Ti, Au, Cr, Ni, etc.), Tin Oxide/Zinc Oxide (TO/GZO) etc.
Process Specifications
Dielectric Etching Uniformity < 5%, Metal Etching Uniformity < 5%, Particle Control (≤ 10 ea @ 0.2 µm)
Application Fields
IC, Power Devices, RF Integration, Semiconductor Optics, Optical Communications, Research, etc.
Equipment Dimensions
2-4 chambers 2560*2426*2863 (W*D*H), 8 chambers 5252*2412*2959(W*D*H)
Technical Features
· The machine can achieve multi-size compatibility;
· The process chambers have been optimized for design, providing excellent cleanliness control;
· Compatible with copper/bowl etching solutions in the same chamber and can achieve independent recycling and reuse, up to 4 types of solutions in the same chamber;
· Can be used in conjunction with Nano spray process and IPA N2 dry drying processes;
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