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Single-Chip Chemical Cleaning Machine ACL Series
A single - wafer chemical cleaning equipment. It uses customized chemical reagents and cleaning processes to target and remove contaminants (such as particles and organic residues) on the wafer surface. It avoids cross - contamination in batch cleaning, improves cleaning efficiency and cleanliness, and is suitable for high - precision semiconductor manufacturing scenarios.
Single-chip chemical cleaning machine ACL series equipment configuration
2-8 chambers (optional)
Substrate materials
Si, SiC, LN, LT
Applicable processes
Substrate and epitaxial cleaning, PR strip, Oxide removal, etc.
Process indicators
Particle control (≤ 10 per 0.1 µm), Metal ion control (5E9 atms/cm2)
Application fields
IC, power, RF, semiconductor optics, optical communication, research, reticle, etc.
Equipment dimensions
2-4 chambers 2560*2426*2863 (W*D*H), 8 chambers 5252*24122959 (W*D*H)
Technical features
· The machine can achieve compatibility with multiple sizes;
· Multi-layer cup structure can achieve separation of cleaning solutions;
Integrated intelligent Auto Clean function, which can meet the requirements of high-temperature SPM processes and reduce PM frequency.
2-8 chambers (optional)
Substrate materials
Si, SiC, LN, LT
Applicable processes
Substrate and epitaxial cleaning, PR strip, Oxide removal, etc.
Process indicators
Particle control (≤ 10 per 0.1 µm), Metal ion control (5E9 atms/cm2)
Application fields
IC, power, RF, semiconductor optics, optical communication, research, reticle, etc.
Equipment dimensions
2-4 chambers 2560*2426*2863 (W*D*H), 8 chambers 5252*24122959 (W*D*H)
Technical features
· The machine can achieve compatibility with multiple sizes;
· Multi-layer cup structure can achieve separation of cleaning solutions;
Integrated intelligent Auto Clean function, which can meet the requirements of high-temperature SPM processes and reduce PM frequency.
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