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Adhesive Removal and Peeling Machine AST Series
The Adhesive Removal and Peeling Machine AST Series (PR STRIPPER/METAL LIFT - OFF) is an Advanced Process Equipment integrating photoresist stripping and metal lift-off functions. It efficiently removes photoresist and excess metal layers via chemical reagents or physical assistance methods, with a design that minimizes damage to the substrate and ensures the integrity of semiconductor device structures. Tailored for semiconductor manufacturing, it perfectly adapts to post-stripping processes, meeting the high-precision demands of advanced microfabrication workflows.
Equipment Configuration
1-2 Soak, 1-2 Stripper, 1-2 Clean
Substrate Materials
Si, Glass, Sapphire, GaAS, InP, GaN, SiC, LT, LN
Applicable Processes
Metal Deposition, Photoresist Removal
Process Specifications
Particle Control ≤ 20 ea @ 0.2 µm, Metal Removal Rate > 99%, Photoresist Removal Rate > 99%
Application Fields
Advanced Packaging, MEMS, Power Devices, RF Integrated Circuits, Semiconductor Optics, Optical Communications, Research and Development, etc.
Equipment Dimensions
3-chamber 2230*1980*2450 (W*D*H), 6-chamber 3040*1980*2760 (W*D*H)
Technical Features
· The equipment is a fully automatic machine that can automatically complete the photoresist removal and metal deposition processes;
· The equipment is equipped with three process chambers for soaking, photoresist removal, and cleaning;
· The soaking unit uses a solution to soak the wafer surface to dissolve the photoresist;
· The photoresist removal unit removes the metal and photoresist on the wafer surface;
· The cleaning unit performs cleaning and drying to achieve dry entry and exit of the wafer;
· The photoresist removal solution can be filtered and recycled for use;
1-2 Soak, 1-2 Stripper, 1-2 Clean
Substrate Materials
Si, Glass, Sapphire, GaAS, InP, GaN, SiC, LT, LN
Applicable Processes
Metal Deposition, Photoresist Removal
Process Specifications
Particle Control ≤ 20 ea @ 0.2 µm, Metal Removal Rate > 99%, Photoresist Removal Rate > 99%
Application Fields
Advanced Packaging, MEMS, Power Devices, RF Integrated Circuits, Semiconductor Optics, Optical Communications, Research and Development, etc.
Equipment Dimensions
3-chamber 2230*1980*2450 (W*D*H), 6-chamber 3040*1980*2760 (W*D*H)
Technical Features
· The equipment is a fully automatic machine that can automatically complete the photoresist removal and metal deposition processes;
· The equipment is equipped with three process chambers for soaking, photoresist removal, and cleaning;
· The soaking unit uses a solution to soak the wafer surface to dissolve the photoresist;
· The photoresist removal unit removes the metal and photoresist on the wafer surface;
· The cleaning unit performs cleaning and drying to achieve dry entry and exit of the wafer;
· The photoresist removal solution can be filtered and recycled for use;
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