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12-inch uniform coating developer machine ACD12
A 12-inch wafer - dedicated integrated coating and developing equipment. It enables uniform photoresist coating and precise developing. By optimizing parameters like coating rotation speed and developing time, it ensures the consistency of coating thickness on the wafer surface and pattern resolution, adapting to advanced semiconductor lithography process requirements.
Equipment configuration
2C2D, 4C, 4D, 4C4D
Substrate materials
Si, Glass, etc.
Applicable processes
i-line, KrF, ArF, PI, SOG, SOC
Application fields
IC, advanced packaging, power devices, semiconductor optics, research, reticle, etc.
Equipment dimensions
4970*1973*2460mm (Width x Depth x Height)
Technical features
· The equipment has a small footprint, high production capacity, and flexible selection of process units;
· It can handle wafers with a thickness of 5mm or less or ultra-thin wafers during transportation and processing;
· It can achieve complete compatibility of two sizes;
· Optional high-precision heating plates, optical alignment, WEE and other unit components can be selected;
· Optional interface module can be selected to achieve Inline function;
2C2D, 4C, 4D, 4C4D
Substrate materials
Si, Glass, etc.
Applicable processes
i-line, KrF, ArF, PI, SOG, SOC
Application fields
IC, advanced packaging, power devices, semiconductor optics, research, reticle, etc.
Equipment dimensions
4970*1973*2460mm (Width x Depth x Height)
Technical features
· The equipment has a small footprint, high production capacity, and flexible selection of process units;
· It can handle wafers with a thickness of 5mm or less or ultra-thin wafers during transportation and processing;
· It can achieve complete compatibility of two sizes;
· Optional high-precision heating plates, optical alignment, WEE and other unit components can be selected;
· Optional interface module can be selected to achieve Inline function;
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