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Full-automatic wafer tape mounting equipment
ATW5000 series tape mounting machine is applicable to the tape mounting process before wafer thinning. Advanced roller tape mounting technology is applied to the equipment.
which can complete the contact tape mounting process of 8/12 inch wafer.
Equipment model:
GTR500 series
Product features:
GTR500 series
Product features:
• Advanced anti-static roller tape mounting technology is applied
• Manual wafer/wafer ring loading and unloading
• Automatic tape feeding/mounting/dicing (DAF tape automatic alignment/peeling/mounting)
• Self-winding adhesive tape isolation tape
• Automatic winding of waste tape
Technical specification and parameter:
• Wafer type: silicon wafer/silicon carbide/gallium arsenide
• Wafer size: 4"~ 8"/ 8" ~12"
• Wafer thickness: less than 8" ≥ 100um; 12" ≥ 200um;
• Tape type: Blue tape/UV tape/DAF tape ("three-in-one" tape compatibility functions are optional)
• Tape width: Max. 420mm
• Ring spec.: 6"/8"/12"Disco standard ring
• Carrier type: Vacuum airway, porous metal and microporous ceramics are optional
• Power consumption: AC220V 8A
• Control system: PLC & 7" touch screen
• Electrostatic elimination: Ion air pump
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