Desktop semi-automatic substrate tape mounting equipment

Wafer tape mounting process equipment before wafer thinning and dicing process in semiconductor post-process.

• Corresponding processing of 4"~8"/8"~"12" wafer products

• Wafer Taper corresponding handling of tape thinning. After replacing the module, the platform can handle LC tape or PR tape

• Wafer Mounter corresponding handling of cut tape (Blue/UV/DAF tape)

Description

Equipment model:
GTR308 series

Product features:

• Advanced anti-static roller tape mounting technology is applied

• Automatic tape feeding / tape mounting

• Manual substrate/Frame loading and unloading

• Manual tape dicing

• Manual waste tape collection

Technical specification and parameter:

• Substrate spec.: Based on customer products (QFN/DFN/ PCB/Ceramic/Glass)

• Ring spec.: 8 "/12" ring (customizable square ring)

• Tape type: Blue tape/UV tape

• Tape width: Max. 420mm

• Carrier type: Vacuum airway, vacuum chuck

• Carrier heating: Room temperature ~ 100℃ (optional)

• Power consumption: AC220V 5A

• Control system: PLC & 7" touch screen

• Electrostatic elimination: Ion wind rod

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